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Instrument Description

Type:
PCB Prototyping
Make:
LPKF
Model:
MultiPress S

Usage Info

Availability:
Internal and external researchers
Training Requirements:

Request training via iLab.

*Safety related prerequisite trainings may be required.

SRA-approved rates:
Yes

Location

Campus:
Evansdale
College:
Benjamin M. Statler College of Engineering and Mineral Resources
Department:
Innovation Hub
Address:
Engineering Sciences Building G75E

LPKF MultiPress S Multilayer Press

The LPKF MultiPress S bench-top multilayer press laminates multilayer circuits in rigid, flex-rigid and flexible PCB materials.

Capabilities/Specifications

  • Number of layers: 8-layer maximum
  • Temperature: 300°C maximum
  • Laminating Pressure: 2-ton hydraulic system
  • Laminating Area: 9" x 12" material

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