Instrument Description
Type:
Soldering
Make:
PACE
Model:
TF 2800 BGA/SMD Rework System
Manufacturer URL:
PACE TF 2800 BGA/SMD Rework System
PACE TF 2800 BGA/SMD Rework System
Usage Info
Availability:
Internal and external researchers
Internal and external researchers
Training Requirements:
Request training via iLab.
*Safety related prerequisite trainings may be required.
SRA-approved rates:
Yes
Yes
Location
Campus:
Evansdale
College:
Benjamin M. Statler College of Engineering and Mineral Resources
Department:
Innovation Hub
Address:
Engineering Sciences Building G75E
PACE TF 2800 BGA/SMD Rework System
The PACE TF 2800 BGA/SMD Rework System uses patented Inductive-Convection Heating Technology and provides the ultimate thermal performance with its ability to reach the target temperature in seconds to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom-terminated components.
Capabilities/Specifications
- Placement Accuracy: 28µm
- Temperature Setting Range:
- Top Heater: 100˚ to 328˚C (212˚ - 624˚F)
- Bottom Heater: 100˚ to 221˚C (212˚ - 430˚F)
- Max PCB Size: 610mm x 610mm (24" x 24”)
- Component Size
- Maximum: 65mm (2.5") x 65mm (2.5")
- Minimum: 1mm Sq.
Contact
